Grant
International collaboration EU and Japan on semiconductors
- Organisation
- European Commission (Funding & Tenders)
- Where
- Worldwide
- Mode
- On site
- Funding
- See details
- For
- Professionals, PhD & postdoctoral
- Deadline
- 8 December 2026 (45 days left)
- Source
- Call for proposals from the EU Funding & Tenders Portal (© European Union)
About
Expected Outcome:
Projects are expected to contribute to the following expected outcomes:
Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities.
Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem
Expected outcomes should have direct and immediate impact on European industry.
Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged w
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